▎ 摘　　要

NOVELTY - Heat conductive adhesive, comprises 14-25 wt.% epoxy resin, 5-12 wt.% aqueous polyurethane, 1-5 wt.% ethyl acetate, 25-60 wt.% heat-conducting filler, 5-12 wt.% dicyandiamide, 8-15 wt.% vinyl acetate, 6-9 wt.% polyacrylamide, 7-12 wt.% diluent, 0.2-2 wt.% curing agent, 0.4-0.8 wt.% accelerant, 0.5-1.2 wt.% toughening agent and 0.5-1 wt.% defoaming agent. USE - The heat conductive adhesive is useful for microelectronic device. ADVANTAGE - The adhesive: is economical and environmentally friendly; has excellent viscosity and heat conducting performance; and does not contain harmful substance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the heat conductive adhesive comprising (1) adding aqueous polyurethane, ethyl acetate, dicyandiamide, vinyl acetate, polyacrylamide and a diluent into a reaction vessel, and reacting for 20-50 minutes at the temperature of 40-60℃, (2) adding epoxy resin into the mixed solution, heating to 70-85 ℃, and reacting for 30-60 minutes to obtain modified epoxy resin, and (3) adding the heat-conducting filler, curing agent, accelerator, toughening agent and defoaming agent into the modified epoxy resin, and stirring for 30 minutes to obtain the final product.