• 专利标题:   Thermally conductive adhesive used in e.g. light diffusion function protective coating, is obtained by using e.g. acrylate resin prepared by using e.g. acrylate monomer or acrylic modified epoxy resin, vinyl silicone monomer, alkenyl aromatic monomer, and thermal initiator or redox initiator.
  • 专利号:   CN112980360-A, CN112980360-B
  • 发明人:   TANG Y, YANG D, JIANG S
  • 专利权人:   SHANGHAI XIYI NEW MATERIALS TECHNOLOGY C
  • 国际专利分类:   C09J011/04, C09J011/08, C09J125/14, C09J133/10, C09J135/04, G02B005/02
  • 专利详细信息:   CN112980360-A 18 Jun 2021 C09J-133/10 202166 Pages: 14 Chinese
  • 申请详细信息:   CN112980360-A CN10344789 31 Mar 2021
  • 优先权号:   CN10344789

▎ 摘  要

NOVELTY - A thermally conductive adhesive is obtained by stirring, mixing and in-situ polymerizing environmentally-friendly acrylate resin, environmentally-friendly solvents, processing additives, core-shell graphene/polymer composite microspheres and alkenyl-modified inorganic nano thermal conductive materials. After the thermally conductive adhesive with light diffusion function is cured, the haze is not less than 80%, the transmittance is not less than 50%, and the thermal conductivity is not less than 1 W/(m.K). The environmentally-friendly acrylate resin is prepared by dissolving 25-65 wt.% acrylate monomer or acrylic modified epoxy resin, 10-40 wt.% vinyl silicone monomer, 5-40 wt.% olefin monomers and 0-30 wt.% alkenyl aromatic monomers in 20-60 wt.% environmentally-friendly solvents, and performing solution polymerization method using 0.1-1 wt.% thermal initiator or redox initiator, to obtain environmentally-friendly acrylate resin with solid content of 40-80 wt.%. USE - Thermally conductive adhesive used in light diffusion function protective coatings or adhesives for lighting equipment, liquid crystal displays, and LED equipment (all claimed). ADVANTAGE - The thermally conductive adhesive is environmentally-friendly and has excellent safety, moisture resistance, heat resistance, rapid curing property, storage stability and bonding strength. DETAILED DESCRIPTION - A thermally conductive adhesive is obtained by stirring, mixing and in-situ polymerizing 10-90 wt.% environmentally-friendly acrylate resin, 0-40 wt.% environmentally-friendly solvents, 0-20 wt.% processing additives, 5-40 wt.% core-shell graphene/polymer composite microspheres with particle size of 100 nm-100 mu m and remainder of alkenyl-modified inorganic nano thermal conductive materials with a particle size of 1-100 nm. After the thermally conductive adhesive with light diffusion function is cured, the haze is not less than 80%, the transmittance is not less than 50%, and the thermal conductivity is not less than 1 W/(m.K). The environmentally-friendly acrylate resin is prepared by dissolving 25-65 wt.% acrylate monomer or acrylic modified epoxy resin, 10-40 wt.% vinyl silicone monomer, 5-40 wt.% olefin monomers and 0-30 wt.% alkenyl aromatic monomers in 20-60 wt.% environmentally-friendly solvents, and performing solution polymerization method using 0.1-1 wt.% thermal initiator or redox initiator, to obtain environmentally-friendly acrylate resin with solid content of 40-80 wt.%. The core-shell structured graphene/polymer composite microspheres are prepared by dispersing 25-65 wt.% alkenyl modified graphene, 25-65 wt.% acrylate monomers, 1-20 wt.% alkenyl crosslinkable monomer, 30-60 wt.% alkenyl aromatic compound monomers, 1-10 wt.% surfactant in 20-60 wt.% water, and performing emulsion polymerization, dispersion polymerization or suspension polymerization copolymerization, to obtain a polymer with particle size of 100-100 mu m as the core and graphene as the shell. An INDEPENDENT CLAIM is included for manufacture of the conductive adhesive, which involves (i) preparing the core-shell structure graphene/polymer composite microspheres by (i-1) adding 1 pt. wt. graphene oxide and/or graphene, 0-2 pts. wt. optional additives, and 0.01-0.5 pts. wt. alkenyl compound into 10-1000 pts. wt. dispersion medium, reacting for 0.1-72 hours at 5-300 degrees C, chemically grafting the alkenyl group on the graphene sheet to obtain alkenyl-modified graphene, (i-2) adding the alkenyl-modified graphene with acrylic monomers, alkenyl crosslinkable monomers, alkenyl aromatic compound monomers and surfactants to the water and mixing, stirring and emulsifying at 100-2000 rpm, (i-3) subjecting the obtained compound at 100 degrees C or less, subjecting the obtained product to emulsion polymerization, dispersion polymerization, and suspension polymerization copolymerization for 1-100 hours at a speed of 100-1500 rpm, (i-4) separating and washing the product to obtain core-shell structure graphene/polymer composite microspheres, (ii) preparing the thermally conductive adhesive by (ii-1) by adding core-shell structure graphene/polymer composite microspheres, acrylic monomers or acrylic modified epoxy resins, vinyl silicone monomers, olefin monomers, alkenyl aromatic compound monomers and optional blending resins to environmentally-friendly solvents and processing additives and mixing, and stirring evenly at 100-1500 rpm and at 5-100 degrees C, (ii-2) adding thermal initiator or redox initiator, optional additive agent to optional solvent and mixing, and stirring evenly at 100-5000 rpm, and (ii-3) adding the product obtained in step (ii-1) to the product obtained in step (ii-2), and performing a solution polymerization reaction at a speed of 100-1500 rpm for 1-100 hours.