▎ 摘　　要

NOVELTY - The utility model claims a packaging structure of chip, belonging to the technical field of semiconductor packaging. the active surface of the chip main body (100) and the upper surface of the chip electrode (101) are provided with a protective layer (200), the protective layer opening (201) is provided with a metal bump (300), the back surface of the chip main body (100) is orderly provided with an adhesive layer (601); a seed layer (602), the adhesive layer (601) covers the back surface of the chip body (100); the lower surface of the seed layer (602) is orderly provided with a back gold block (600) and a graphene layer (610), the coating layer (700) covers the bare surface of the back gold block (600) and the graphene layer (610), and extends upwards to the peripheral edge of the lower surface of the adhesive layer (601). The utility model can effectively overcome wafer warpage and fragment, radiating problem, reduces the scribing difficulty, solves the problem of warping and cracking caused by packaging finished product.