▎ 摘　　要

NOVELTY - A heat-dissipating material comprises layer (A) containing 40-60 wt.% graphite powder, 0-5 wt.% graphene, 20-30 wt.% boron nitride, 10-20 wt.% aluminum nitride and 0-5 wt.% acrylic acid, layer (B) which is a metal substrate made of copper or aluminum foil and ceramic foam layer (C). The layer (C) comprises 90-95 %mass high-purity silicon carbide powder having particle size of 0.3 mu m, 0-5 %mass alumina and 0-5 %mass yttrium(III) oxide. The ceramic foam layer has three-dimensional network connected structure with foam aperture of 8-60 ppi. USE - Heat-dissipating material is used in backlight module (claimed). ADVANTAGE - The heat-dissipating material prolongs durability of the backlight module. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for usage method of heat-dissipating material in backlight module, which involves affixing heat-dissipating material to inside of a plastic backplate of a backlight module which is in contact with an aluminum frame mounted with a lamp strip, such that heat generated by the lamp strip is dissipated through the heat-dissipating material.