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  • 专利标题:   Preparation of packaging material for electronics comprises mixing, encapsulation and burning oxidized graphene, silicon carbide and aluminum alloy powder containing silicon, titanium-boron, beryllium and aluminum powder.
  • 专利号:   CN105603262-A
  • 发明人:   WANG S, WANG X, ZHANG X, HUANG L, LI J
  • 专利权人:   AVIC BEIJING INST AERONAUTICAL MATERIALS
  • 国际专利分类:   C22C001/05, C22C001/10, C22C021/00, C22C029/06, C22C030/00, C22C032/00, H01L021/48
  • 专利详细信息:   CN105603262-A 25 May 2016 C22C-021/00 201654 Pages: 6 Chinese
  • 申请详细信息:   CN105603262-A CN10971756 22 Dec 2015
  • 优先权号:   CN10971756

▎ 摘　　要

NOVELTY - Preparation of packaging material comprises mixing 2 wt.% oxidized graphene, 50 wt.% silicon carbide and balance aluminum alloy powder containing 55 wt.% silicon, 15 wt.% titanium-boron, 0.2 wt.% beryllium and 15 wt.% aluminum powder where the preparation method comprises mixing, encapsulation and burning. USE - Preparation of packaging material for electronics.