• 专利标题:   Semiconductor device used for field effect transistor, comprises ribbon-shaped catalyst layer formed on crystal substrate, layer containing ribbon-shaped boron nitride, for covering catalyst layer, and ribbon-shaped graphene.
  • 专利号:   JP2017163042-A
  • 发明人:   KONDO T
  • 专利权人:   FUJITSU LTD
  • 国际专利分类:   B01J023/745, B01J035/02, C01B021/064, H01L021/336, H01L029/786
  • 专利详细信息:   JP2017163042-A 14 Sep 2017 H01L-029/786 201766 Pages: 19 Japanese
  • 申请详细信息:   JP2017163042-A JP047410 10 Mar 2016
  • 优先权号:   JP047410

▎ 摘  要

NOVELTY - A semiconductor device comprises a ribbon-shaped catalyst layer (20) used as catalyst for boron nitride formed on a crystal substrate (10) having insulating properties, a layer (30) containing ribbon-shaped boron nitride formed of hexagonal boron nitride, boron carbonitride, or cubic-boron carbonitride, for covering the catalyst layer, a ribbon-shaped graphene (40) for covering the layer containing boron nitride, and a source electrode (52) and drain electrode (53), formed on the graphene. USE - Semiconductor device is used for field effect transistor. ADVANTAGE - The semiconductor device has favorable characteristics, and is obtained by economical method with high yield. DETAILED DESCRIPTION - A semiconductor device comprises a ribbon-shaped catalyst layer used as catalyst for boron nitride formed on a crystal substrate having insulating properties, a layer containing ribbon-shaped boron nitride formed of hexagonal boron nitride (h-BN), boron carbonitride (BCN), cubic-boron carbonitride (BC2N), or boron carbonitride (BC6N), for covering the catalyst layer, a ribbon-shaped graphene for covering the layer containing boron nitride, and a source electrode and drain electrode formed on the graphene. INDEPENDENT CLAIMS are included for the following: (1) manufacture of ribbon-shaped thin film, which involves forming the catalyst layer on the crystal substrate, heating the crystal substrate, forming the catalyst layer into ribbon shape by forming hexagonal boron nitride (h-BN), boron carbonitride (BCN), cubic-boron carbonitride (BC2N), or boron carbonitride (BC6N), and forming the layer containing ribbon-shaped boron nitride; and (2) manufacture of the semiconductor device, which involves forming ribbon-shaped graphene on the ribbon-shaped boron nitride-containing layer, and forming source electrode and drain electrode on the graphene. DESCRIPTION OF DRAWING(S) - The drawing shows schematic view explaining manufacture of the semiconductor device. (Drawing includes non-English language text) Crystal substrate (10) Ribbon-shaped catalyst layer (20) Layer containing boron nitride (30) Ribbon-shaped graphene (40) Source electrode (52) Drain electrode (53)