▎ 摘　　要

NOVELTY - The method involves preparing a planar diamond base material. A predetermined thickness of a partial area of one side or both sides of the diamond base material is converted into vertical graphene, where the diamond base material serves as a heat spreader, and a graphene layer formed on the diamond base material serves as a thermal interface material (TIM). The process is performed by hydrogen plasma treatment. The hydrogen plasma treatment is performed at a temperature of 1000degrees C. to 1500degrees C. The process is performed in a chamber by high-temperature heat treatment. The high-temperature heat treatment is performed at a temperature of 1500degrees C. to 2000degrees C. The high-temperature heat treatment is performed in a hydrogen gas atmosphere. The process is performed in a vacuum chamber by laser treatment. The diamond base material is a chemical vapor deposition (CVD) polycrystalline diamond. USE - Method for manufacturing diamond-graphene hybrid thermal management material used in electronic device. ADVANTAGE - The thermal management material is horizontally maintained and deformation of graphene formed at an acute angle is minimized when diamond edges are remained during the formation of graphene on the surface of the diamond, thus maximizing heat transfer efficiency during modulation by pressurizing. The heat resistance is considerably reduced at a thermal interface to improve thermal management capability and also size of a thermal management module is reduced according to the diamond hybrid structure-based assembled thermal management material and the method of modulating the pressurized thermal management material using the same according to the present invention as described above. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a method for manufacturing diamond-graphene hybrid heat spreader-heat sink assembled thermal management material; and (2) a method for modulating diamond-graphene hybrid thermal management material.