• 专利标题:   Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.
  • 专利号:   CN113716552-A, CN113716552-B
  • 发明人:   LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G
  • 专利权人:   NORTHWEST INST NONFERROUS METALS
  • 国际专利分类:   C01B032/184, C01B032/198, C21D001/26, C22F001/08, C23C014/02, C23C014/16, C23C014/35, C23C008/64, C25D013/02
  • 专利详细信息:   CN113716552-A 30 Nov 2021 C01B-032/184 202215 Chinese
  • 申请详细信息:   CN113716552-A CN11047657 08 Sep 2021
  • 优先权号:   CN11047657

▎ 摘  要

NOVELTY - Preparing high-orientation and high thermal conductivity graphene/copper composite material comprises (i) adding isopropanol into ethanol, ultrasonically processing at room temperature, adding nitrate, and preparing large diameter graphene oxide sheet dispersion as electrophoresis liquid, (ii) pre-processing and modifying the copper foil surface, providing modified copper foil as cathode for electrophoretic deposition, (iii) depositing large diameter graphene oxide sheet in the electrophoresis liquid on modified titanium layer of the cathode of modified copper foil to obtain preferred orientation arranged graphene oxide/copper foil, (iv) folding foil to obtain folded body, (v) stacking the folded body layer by layer in graphite mold for electric sparking out the plasma sintering, and (vi) forming highly oriented graphene film, and obtaining high orientation and high thermal conductivity graphene/copper composite material connected by three-dimensional network of the copper base body. USE - The high-orientation and high thermal conductivity graphene/copper composite material is used as thermal-conducting reinforcing body for electronic device heat power density. ADVANTAGE - The method solves problem that the graphene is difficult to control when using as thermal-conducting reinforcing body, and is difficult to control the orientation degree, combines interface modification and three-dimensional network connection of the copper substrate, and improves whole strength of the graphene/copper composite material. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of folding and stacking process of preferred oriented graphene oxide/copper foil (Drawing includes non-English language text).