▎ 摘　　要

NOVELTY - Electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, comprises 30-99.85 wt.% polymer component based on the weight of the deposition material; where the polymer component comprises a high temperature polymer; 0.1-60 wt.% filler component based on the weight of the deposition material; where the filler component comprises a strengthening component and a conductive component; and 0.05-10 wt.% extrudability component based on the weight of the deposition material; where the extrudability component comprises a rheological component and a dispersion component; where the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component. USE - As electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system. ADVANTAGE - The deposition material can form 3D objects which exhibit high temperature/high strength and/or are electrically conductive and is suitable for use in applications requiring high strength at high temperature, for example, high strength, high temperature applications in aerospace comprising aerospace ducting, oil and gas, electronics, sensors, and automotive industries. DETAILED DESCRIPTION - Electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, comprises 30-99.85 wt.% polymer component based on the weight of the deposition material; where the polymer component comprises a high temperature polymer; 0.1-60 wt.% filler component based on the weight of the deposition material; where the filler component comprises a strengthening component and a conductive component; and 0.05-10 wt.% extrudability component based on the weight of the deposition material; where the extrudability component comprises a rheological component and a dispersion component; where the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component; and where the electrically conductive deposition material has an electrical resistance of 1x101 ohms to 1x104 ohms or 1x105 ohms to 1x108 ohms.