▎ 摘　　要

NOVELTY - A printed circuit board drilling pad preparing method involves adding 99.90-99.99 wt.% phenolic resin solution and 0.01-0.1 wt.% graphene solution in stirring tank, heating at 40-60 degrees C and stirring for 30-60 minutes after cooling to obtain a composite resin. Special paper is immersed in composite resin, removed and dried to obtain a prepreg tape, followed by laminating the prepreg tape to a desired multiple lamination to obtain the finished product. USE - Method for preparing printed circuit board drilling pad. ADVANTAGE - The method enables preparing printed circuit board drilling pad with strong heat conducting performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a printed circuit board drilling pad is prepared by the method.