▎ 摘　　要

NOVELTY - The high-conductivity copper alloy plate comprises 0.01-0.05 wt.% silver, 0.8-1.5 wt.% nickel, 0.01-0.03 wt.% tungsten, 0.10-0.20 wt.% tantalum, 0.05-0.13 wt.% antimony, 0.03-0.06 wt.% hafnium, 0.01-0.03 wt.% holmium, 0.001-0.003 wt.% graphene-coated nano-aluminum powder, 0.1-0.3 wt.% additive component comprising tin, boron, manganese, cesium, calcium or scandium, and balance nano-copper powder. USE - High-conductivity copper alloy plate. ADVANTAGE - The high conductivity copper alloy plate has excellent heat resistance, heat dissipation and mechanical strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of high-conductivity copper alloy plate material by uniformly mixing each component according to weight percentage; adding into smelting furnace for smelting; adding refining agent; spraying inert gas to refine while heat preserving for 15-30 minutes each time; sequentially slagging and filtering to obtain refined solution after refining; sampling and testing chemical composition; comparing difference between design component and measured component; and performing fine adjustment to ensure that alloy component reaches design component requirement; injecting qualified molten liquid, into mold; casting and forming to obtain alloy blank; and subjecting alloy blank to heat treatment to obtain high-conductivity copper alloy plate.