• 专利标题:   Slip-type heat dissipation pad useful for preventing damage to heat dissipation pad, comprises plate-shaped heat conduction layer in which heat diffusion material is mixed and skin layer on one surface of heat conduction layer.
  • 专利号:   KR2023000689-A
  • 发明人:   YOON K S, CHOI B I, YEO C
  • 专利权人:   SILICONE VALLEY CO LTD
  • 国际专利分类:   C08K003/04, H05K007/20
  • 专利详细信息:   KR2023000689-A 03 Jan 2023 H05K-007/20 202304 Pages: 8
  • 申请详细信息:   KR2023000689-A KR083115 25 Jun 2021
  • 优先权号:   KR083115

▎ 摘  要

NOVELTY - Slip-type heat dissipation pad comprises plate-shaped heat conduction layer in which heat diffusion material (3) is mixed and skin layer (2) made of silicon laminated on one surface of heat conduction layer (1). USE - The slip-type heat dissipation pad is useful for preventing damage to a heat dissipation pad. ADVANTAGE - The slip-type heat dissipation pad increases thermal conductivity while improving surface durability through surface treatment of skin layer made of silicon. DESCRIPTION OF DRAWING(S) - The diagram shows a longitudinal cross-sectional view illustrating a slip-type heat dissipation pad. 1Thermal conduction layer 2Skin Layer 3Thermal diffusion material