• 专利标题:   Modified silver-coated copper conductive powder epoxy conductive adhesive used as eutectic tin/palladium solder in electronic package, has bisphenol A epoxy resin, sheet-shaped silver coated copper conductive powder, spherical silver coated copper conductive powder, and nitrogen doped graphene.
  • 专利号:   CN114456736-A
  • 发明人:   GAO G, XIE J, YAN M, FAN W, CHEN P
  • 专利权人:   UNIV ANHUI
  • 国际专利分类:   C08G059/68, C09J011/04, C09J011/06, C09J163/02, C09J009/02
  • 专利详细信息:   CN114456736-A 10 May 2022 C09J-009/02 202263 Chinese
  • 申请详细信息:   CN114456736-A CN10146753 17 Feb 2022
  • 优先权号:   CN10146753

▎ 摘  要

NOVELTY - Modified silver-coated copper conductive powder epoxy conductive adhesive comprises 20-35 wt.% bisphenol A type epoxy resin, 35-47 wt.% sheet-shaped silver coated copper conductive powder, 10-15 wt.% spherical silver coated copper conductive powder, 0.5-1 wt.% nitrogen doped graphene, 1-2.2 wt.% coupling agent, 10-12 wt.% diluent, 5-8 wt.% curing agent, 0.5-1.5 wt.% curing accelerator, and 0.4-0.5 wt.% defoaming agent. USE - The modified silver-coated copper conductive powder epoxy conductive adhesive is useful in electronic field and as solder in electronic package. ADVANTAGE - The modified silver-coated copper conductive powder epoxy conductive adhesive has excellent conductive effect, and prevents electromigration and reduces the production cost of pure silver, sheet, and nitrogen doped graphite conductive filler, and increases the conductive network. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of silver coated copper conductive powder epoxy conductive adhesive comprising: (1) heating bisphenol A type epoxy resin for 5-10 minutes at 40-70degrees Celsius in an oven until there is no bubble; (2) dispersing the sheet-shaped copper-coated silver conductive powder and spherical silver-coated copper conductive powder in a centrifugal tube filled with diluent, adding coupling agent and ultrasonically processing for 1-2 hours at 30-50degrees Celsius, removing the supernatant after centrifuging, adding absolute ethanol with the same quality, vibrating and dispersing, centrifuging again, removing the supernatant, moving the precipitate into a beaker to obtain modified silver-coated copper conductive powder, heating the modified silver-coated copper conductive powder for 2-10 minutes at 40-70degrees Celsius in oven; (3) adding the pre-heated bisphenol A epoxy resin into the modified silver-coated copper conductive powder, fast stirring until there is no phase separation; (4) before the diluent is not volatilized, small amount of nitrogen doped graphene is added, then stirring for 10-30 minutes; (5) adding defoaming agent, stirring uniformly to form component A; (6) mixing the curing agent and curing accelerator, stirring uniformly to form component B; (7) fully stirring and mixing the components A and B uniformly; (8) moving mixed material to vacuum dry box and vacuumizing for 10-20 minutes at 40-60degrees Celsius.