• 专利标题:   Liquid metal conductive paste for forming conductive circuit, comprises conductive powder, base resin, solvent, additive, and liquid metal solid-loaded powder comprising liquid metal liquid drop and solid powder coated outside liquid drop.
  • 专利号:   CN113053559-A
  • 发明人:   MEN Z, DONG S
  • 专利权人:   BEIJING MENGZHIMO TECHNOLOGY CO LTD
  • 国际专利分类:   H01B001/16, H01B001/22, H01B013/00
  • 专利详细信息:   CN113053559-A 29 Jun 2021 H01B-001/16 202164 Pages: 10 Chinese
  • 申请详细信息:   CN113053559-A CN11376461 27 Dec 2019
  • 优先权号:   CN11376461

▎ 摘  要

NOVELTY - A liquid metal conductive paste comprises a liquid metal solid-loaded powder, a conductive powder, a base resin, a solvent and an additive. The liquid metal solid-loaded powder comprises liquid metal liquid drop and solid powder coated outside the liquid drop. The melting point of liquid metal in the liquid metal liquid drop is lower than room temperature. USE - Liquid metal conductive paste for forming conductive circuit for electronic device (all claimed). ADVANTAGE - The liquid metal conductive paste reduces liquid metal leakage. The conductive circuit made of the liquid metal conductive paste has excellent flexibility and conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the conductive paste.