▎ 摘　　要

NOVELTY - Low dielectric composition comprises 100 pts. wt. an epoxy resin, a hardener comprising 15-25 pts. wt. a flame retardant hardener and 70-100 pts. wt. a benzoxazine resin, where the benzoxazine resin is aromatic amine functional group, 80-120 pts. wt. halogen free flame retardant and 80-120 pts. wt. accelerator. USE - The low dielectric composition is useful in laminated plate of a printed circuit board (claimed), preferably in information, communications, consumer electronics products, automobiles, spaceflight, military, industrial products and precision instruments. ADVANTAGE - The composition has excellent dielectric properties, high glass transition temperature, low thermal expansion coefficient, high heat resistance, good flame retardance and excellent printed circuit board processing performance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: Laminated plate comprises a resin substrate comprising a multiple of semi-cured film, and each of the semi-cured film is coated by a coating glass fiber cloth with low dielectric composition, and a metal foil layer is set on at least one surface of the resin substrate; and Printed circuit board, comprising the laminated plate.