▎ 摘　　要

NOVELTY - Epoxy resin-based copper-clad plate filled with alumina comprises an electronic glass fiber cloth, a dipping material and a copper foil, where the electronic glass fiber cloth is soaked in the dipping material, and processed into prepreg, the copper foil is set on two sides of the prepreg. The impregnating material comprises 24.9-25.9 wt.% epoxy resin, 0.01-0.03 wt.% accelerant, 2.9-3.5 wt.% curing agent, 7.4-8.4 wt.% modified composite filler and solvent (remaining amount). USE - The epoxy resin-based copper-clad plate filled with alumina is used for electric device insulation and microelectronic device package. ADVANTAGE - The nano-alumina and graphene oxide co-modify the epoxy resin, so that the modified epoxy resins bear larger stress and load. The modified aluminum oxide nano-particle surface modification effect is good, which can effectively enhance the dispersion uniformity of the nanometre aluminum oxide. The nano cerium oxide loaded to the graphene oxide after double modification treatment can effectively ensure the 3-amino propyl trimethoxy silane for grafting modification treatment effect on the surface of the aluminum oxide after mixing, heating and heat preservation ultrasonic treatment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a preparation method of epoxy resin-based copper-clad plate filled with alumina.