▎ 摘　　要

NOVELTY - The structure has a chip set on a substrate, and a radiating fin is set on the chip. The chip comprises a thermal interface material and a heat radiating plate, where the thermal interface material comprises a graphene layer and two low-melting point metal layers. The graphene-containing layer is up and down arranged on the substrate. A melting point of the low-melting point metal layers is ranged between 150 to 230 degrees centigrade. The substrate comprises a radiating ring that surrounds the chip. USE - Semiconductor packaging structure. ADVANTAGE - The structure is designed such that the chip and radiating fin has high heat conducting efficiency. The structure low manufacturing cost. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of a semiconductor packaging structure.