▎ 摘　　要

NOVELTY - The utility model claims a high heat conducting DPC dam ceramic circuit board, comprising a ceramic substrate and a plurality of surrounding dam; the plurality of surrounding dam is set on the upper surface of the ceramic substrate and surrounded to form a packaging cavity, aiming at each packaging cavity, the upper surface of the ceramic substrate is concavely provided with a first recess, the first recess is filled graphene solid crystal heat conducting plate, correspondingly, the lower surface of the ceramic substrate is concavely provided with a second recess, the second recess is filled graphene radiating plate, and the bottom surface of the second recess and the bottom surface of the first recess are formed with a heat conducting hole. through filling graphene the first recess to form a solid crystal heat conducting plate, filling graphene the second recess is formed with a radiating plate, and matched with the heat conducting hole filled graphene the heat conducting column, using the heat conducting column integrally formed connected between the solid crystal heat conducting plate and the radiating plate, effectively improving the heat conducting and radiating performance, It ensures the stable running of the wafer for a long time.