▎ 摘　　要

NOVELTY - Conductive adhesive comprises lignin-based epoxy resin, modified graphene and curing agent in mass ratio of 100:1-5:7-9; the lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent. USE - The conductive adhesive is useful in IGBT module chip. ADVANTAGE - The conductive adhesive: has high adhesive force and conductive effect, and provides semiconductor power module with excellent conductivity and adhesiveness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the conductive adhesive comprising mixing epoxy resin with epichlorohydrin and reacting at 40-80°C for 0.5-3 hours, heating to 60-120°C, dissolving hydroxylated lignin in 10-30 wt.% sodium hydroxide as catalyst and dropwise adding to the reaction system, keeping the reaction temperature at 60-120°C for 1-3 hours, allowing to stand for 6-24 hours, removing the supernatant, washing the lower layer with warm water at 50-60°C, and distilling under reduced pressure in a rotary evaporator to obtain a lignin-based epoxy resin; adding lignin-based epoxy resin into a temperature-controlled magnetic stirrer, heating to 40-110°C, weighing 1-5 wt.% modified graphene and stirring, adding 7-9 wt.% curing agent and stirring for 10-40 minutes, placing at 65-75°C to vacuum out air bubbles to obtain a conductive adhesive.