• 专利标题:   Electroconductive polymer composition used in electronics packaging, comprises electroconductive metal filler material comprising metal particle(s) having aspect ratio, carbon-based filler material having aspect ratio, and polymer matrix.
  • 专利号:   US2021230398-A1
  • 发明人:   CHEN K, TAUBERT C J, VOGT B D, ZHU Y
  • 专利权人:   CHEN K, TAUBERT C J, VOGT B D, ZHU Y, UNIV AKRON
  • 国际专利分类:   H01B001/24, H01B001/22, C08J003/205, C08J003/20, C08K003/04, C08K003/08, C08K007/00, C08K013/04
  • 专利详细信息:   US2021230398-A1 29 Jul 2021 C08K-013/04 202175 English
  • 申请详细信息:   US2021230398-A1 US104283 25 Nov 2020
  • 优先权号:   US966194P, US104283

▎ 摘  要

NOVELTY - An electroconductive polymer composition comprises at least one electroconductive metal filler material comprising several metal particles having an aspect ratio (r1), at least one carbon-based filler material having an aspect ratio (r2), and a polymer matrix. The aspect ratio (r1) is at least ten times more than the aspect ratio (r2). USE - Composition used for electroconductive polymer (claimed) such as electroconductive polymer composite such as electroconductive adhesives (ECAs) used in electronics packaging. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) formation of the electroconductive polymer composition, which involve (A) preparing or obtaining at least one electroconductive metal filler material, (B) preparing or obtaining the carbon-based filler material, (C) preparing or obtaining non-conductive polymer comprising a polymer base, (D) combining the carbon-based filler material and the polymer base and mixing to distribute the carbon-based filler material throughout said polymer base, (E) adding the electroconductive metal filler material having to the mixture of step (D), in which the electroconductive metal filler material comprises less than 15 vol.% mixture, (F) mixing to distribute said carbon-based filler material throughout said polymer base, and (G) curing the mixture to produce; and (2) electroconductive polymer, which comprises 5-15 vol.% electroconductive metal filler material comprising silver flakes having a aspect ratio (r1) of 1-10 and a particle size of 1-1000 microm, 0.001-8 wt.% carbon-based filler material comprising at least one of multi-walled carbon nanotubes having the aspect ratio (r2) of 1000-108 and the particle size of 1-50 nm and an edge-functionalized exfoliated natural graphite having an aspect ratio of 1000-108 and the particle size in a shortest dimension of 0.3-20 nm, and 75-95 vol.% polymer matrix chosen from polydimethylsiloxane, epoxy, polyacrylate, polymethacrylate, and polyurethane, in which the electroconductive metal filler material comprises silver flakes and multi-walled carbon nanotubes or edge-functionalized exfoliated natural graphite are substantially homogeneously distributed throughout the polymer matrix, and aspect ratio (r2) and (r3) are at least 10 times larger than the aspect ratio (r1).