▎ 摘　　要

NOVELTY - Preparing wave absorbing layer plate with low curing deformation degree, involves: 1) mixing resin matrix, wave absorbing agent, auxiliary agent and low-modulus small particles which are micron-sized silicone rubber particles, in mass ratio (10-25): (35-65): (1-2): (4-8), to form low modulus absorbing film; 2) mixing glass fiber, resin matrix and low modulus small particles in mass ratio (19-21): (28-30): 1, to form low-modulus glass fiber prepreg; 3) performing symmetrical and balanced layering of carbon fiber prepreg on surface of molding tool, then performing optionally independently curing; 4) laying the low-modulus absorbing glue film on the surface of the carbon fibre prepreg; 5) laying low modulus glass fiber on the surface of the low modulus absorbing film prepreg; 6) continuously laying the isolating film and ventilated felt on the surface of the low modulus glass fiber, preparing in vacuum bag, co-curing and forming in vacuum bag, cooling and demolding. USE - Method is used for preparing wave absorbing layer plate with low curing deformation degree, used in structure/stealth composite material. ADVANTAGE - The method provides wave absorbing layer plate with low curing deformation degree and wave-absorbing performance. The method introduces low modulus small particles, and adopts co-curing molding, which can obviously reduce deformation of the wave absorbing laminate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an absorbing layer plate with low curing deformation degree. DESCRIPTION OF DRAWING(S) - The drawing shows a structure schematic diagram of the low-curing deformation degree of the wave-absorbing layer plate. 1Comparative example 2Low modulus absorbing film 3Carbon fibre skin