• 专利标题:   Epoxy thermally conductive structural adhesive useful in thermally conductive bonding of metal and components, polychlorinated biphenyl and thermal dissipation aluminum substrate, comprises e.g. phenolic modified epoxy resin, flake graphite, toughening agent, curing agent, dispersant, and stabilizer.
  • 专利号:   CN115558448-A
  • 发明人:   CHEN Z, CAO N, LI F
  • 专利权人:   LI F
  • 国际专利分类:   C09J011/04, C09J163/00, H01G011/78, H01G002/08, H01M010/653, H05K001/02
  • 专利详细信息:   CN115558448-A 03 Jan 2023 C09J-163/00 202315 Chinese
  • 申请详细信息:   CN115558448-A CN11251878 13 Oct 2022
  • 优先权号:   CN11251878

▎ 摘  要

NOVELTY - Epoxy thermally conductive structural adhesive, comprises 10-30 pts. wt. epoxy resin, 5-20 pts. wt. toughening agent, 20-600 pts. wt. thermally conductive filler, 0.2-20 pts. wt. curing agent, 1-10 pts. wt. dispersant, 5-20 pts. wt. viscosity reducer, and 0.3-5 pts. wt. stabilizer. USE - The epoxy thermally conductive structural adhesive is useful in thermally conductive bonding of various components in energy batteries and super capacitors, including thermally conductive bonding of metal and components, PCB (Polychlorinated biphenyl) and thermal dissipation aluminum substrate (claimed). ADVANTAGE - The epoxy thermally conductive structural adhesive has excellent thermal conductivity, high bonding strength, and chemical resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing epoxy thermally conductive structural adhesive, comprising mixing and stirring epoxy resin, toughening agent, thermally conductive filler, curing agent, dispersant, viscosity reducer and stabilizer in a vacuum environment, controlling the speed at 400-1000 revolutions/minute, stirring for 2-4 hours, and mixing uniformly to obtain the epoxy thermally conductive structural adhesive.