▎ 摘　　要

NOVELTY - A heat sink material comprises mixed starting material comprising 70-99 pts. wt. graphene, 5-25 pts. wt. graphite fiber and 2-3 pts. wt. adhesive. USE - Heat sink material for use in portable, electronic devices, cloud computing server and high-power heating electronic device (claimed). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing heat sink material, which involves sintering mixed graphene, graphite fibers and a binder at 800-2000 degrees C, under the pressure of hot conditions of 300-700 kg/cm2, to form graphene fiber tiles, turning the brick surface in graphene fibers of multi-channel grooves, packing the suspension at 500-1200 degrees C under the conditions of use of encapsulating material with graphene fibers brick recess, where the packaging material is a graphene, carbon fibers, silicon carbide, copper, and silver, and the package film thickness is 1-10 mu m. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat sink material.