• 专利标题:   Thermal structure embedded with Copper in graphite alkenyl composite material substrate, has high thermal conductivity copper block that is embedded in pores of graphene-based composite substrate.
  • 专利号:   CN109037174-A
  • 发明人:   LI Y, YU F, HE X
  • 专利权人:   SHENZHEN XICHUANG TECHNOLOGY CO LTD
  • 国际专利分类:   H01L023/373, H01L021/48, H01L033/64
  • 专利详细信息:   CN109037174-A 18 Dec 2018 H01L-023/373 201910 Pages: 10 Chinese
  • 申请详细信息:   CN109037174-A CN10770815 13 Jul 2018
  • 优先权号:   CN10770815

▎ 摘  要

NOVELTY - The structure has a graphene-based composite substrate and a high thermal conductivity copper block (5). The graphene-based composite substrate is perforated longitudinally. A position of a hole is at a contact point of the graphene-based composite substrate and a heat source. The high thermal conductivity copper block is embedded in the pores of the graphene-based composite substrate. USE - Thermal structure embedded with Copper in graphite alkenyl composite material substrate. ADVANTAGE - The heat of the heat source is conducted well in the out-of-plane direction of the high-oriented graphene material, and the high-oriented material with excellent in-plane thermal conductivity is combined to rapidly diffuse heat. Hence, the problem of poor longitudinal thermal conductivity is solved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of thermal structure embedded with Copper in graphite alkenyl composite material substrate. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the thermal structure of high oriented graphene and copper block. Heat-conducting copper block (5) Perforated graphene plate (7)