• 专利标题:   FET formation by depositing channel material comprising graphene or nanostructure on substrate, depositing contact material over channel material, gate, and spacers, and patterning contact material to form self-aligned contact for FET.
  • 专利号:   US2011309334-A1, WO2011160922-A1, DE112011100901-T5, TW201214578-A, GB2494017-A, CN102893381-A, GB2494017-B, DE112011100901-B4, US9368599-B2, TW539528-B1
  • 发明人:   CHANG J, LAUER I, SLEIGHT J, CHANG J B
  • 专利权人:   INT BUSINESS MACHINES CORP, INT BUSINESS MACHINES CORP, IBM UK LTD, INT BUSINESS MACHINES CORP
  • 国际专利分类:   H01L021/84, H01L029/76, H01L029/78, H01L021/336, H01L029/06, H01L029/786, H01L021/768, H01L029/66, H01L051/05, B82Y010/00, H01L051/00
  • 专利详细信息:   US2011309334-A1 22 Dec 2011 H01L-029/78 201203 English
  • 申请详细信息:   US2011309334-A1 US820341 22 Jun 2010
  • 优先权号:   US820341

▎ 摘  要

NOVELTY - A FET is formed by depositing a channel material (203) on a substrate (201), where the channel material comprises graphene or a nanostructure; forming a gate (301) over the channel material; forming spacers (302) adjacent to the gate; depositing a contact material over the channel material, the gate, and the spacers; depositing a dielectric material over the contact material; and patterning the contact material to form a self-aligned contact for the FET, where the self-aligned contact is located over a source region and a drain region of the FET. USE - Method for forming a FET (claimed). ADVANTAGE - The method can provide a self-aligned contact over the source/drain regions in a graphene/nanostructure FET using a contact material with a relatively low contact resistance, so that a FET with good operating characteristics can be achieved. DETAILED DESCRIPTION - Formation of a FET comprises: (A) depositing a channel material (203) on a substrate (201), where the channel material comprises graphene or a nanostructure; (B) forming a gate (301) over a first portion of the channel material; (C) forming spacers (302) adjacent to the gate; (D) depositing a contact material over the channel material, the gate, and the spacers; (E) depositing a dielectric material over the contact material; (F) removing a portion of the dielectric material and a portion of the contact material to expose the top of the gate; (G) recessing the contact material; (H) removing the dielectric material; and (I) patterning the contact material to form a self-aligned contact for the FET, where the self-aligned contact is located over a source region and a drain region of the FET, and the source region and the drain region comprise a second portion of the channel material. An INDEPENDENT CLAIM is included for a FET, comprising a substrate; a channel material located on the substrate and comprising graphene or a nanostructure; a gate located on a first portion of the channel material; and a contact aligned to the gate and comprising a metal silicide, a metal carbide, or a metal. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a FET device after gate and spacer formation. Substrate (201) Channel material (203) FET device (300) Gate (301) Spacers (302)