▎ 摘　　要

NOVELTY - A composite electronic packaging material comprises 20-80 %mass aluminum, 0.01-15 %mass graphene, 0.01-15 %mass carbon nanotubes, 2-70 %mass other ingredients, and unavoidable impurities. The other ingredients comprise diamond, silicon, tungsten, molybdenum, silicon carbide, titanium carbide, boron carbide, zirconium carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, titanium nitride, aluminum oxide, zirconia, titanium boride and/or zirconium boride. USE - Composite electronic packaging material. ADVANTAGE - The composite electronic packaging material has low thermal expansion coefficient and high thermal conductivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) composite electronic packing material processing and shaping device; and (2) processing of composite electronic packaging material, which involves mixing the powder form of above raw materials having particle size of less than 500 microns.