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专利标题: Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.
专利号: CN110431484-A, WO2020150914-A1
发明人: HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H
专利权人: MICROCOSM TECHNOLOGY CO LTD, MICROCOSM TECHNOLOGY CO LTD
国际专利分类: G02F001/1333, G03F007/004, G03F007/027, H05K001/03, C08F267/10, C08G073/10, C08J005/18, C08K003/00, C08K003/04, C08K003/22, C08K003/34, C08K003/36, C08L079/08, C09D179/08
专利详细信息: CN110431484-A 08 Nov 2019 G03F-007/027 201995 Pages: 12 Chinese
申请详细信息: CN110431484-A CN80001576 23 Jan 2019
优先权号: CN80001576, WOCN072781, CN80001576

▎ 摘　　要

NOVELTY - Photosensitive polyimide resin composition comprises photosensitive polyimide derivative (1), filler, photoinitiator, free radical polymeric compound and solvent. The filler is alumina, graphene, inorganic clay, silicon oxide and/or zinc oxide and having a particle size between 10 nm and 1 m. USE - Photosensitive polyimide resin composition. DETAILED DESCRIPTION - Photosensitive polyimide resin composition comprises photosensitive polyimide derivative of formula (1), filler, photoinitiator, free radical polymeric compound and solvent. The filler is alumina, graphene, inorganic clay, silicon oxide and/or zinc oxide and having a particle size between 10 nm and 1 m. X=tetracarboxylic dianhydride; Y'=diamine; and m=1-5000.