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  2. 国际专利信息
  • 专利标题:   Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.
  • 专利号:   WO2021141575-A1, TW202130247-A, TW759918-B1, US2023015912-A1
  • 发明人:   WU K, CHANG C H, CHEN Y Y
  • 专利权人:   HEWLETTPACKARD DEV CO LP, HEWLETTPACKARD DEV CO LP
  • 国际专利分类:   C23C004/04, C25D013/06, G06F001/16, H05K005/03, H05K005/06, B29C045/00, B29C045/14, C23C022/78, C23C028/04, C25D011/02, C25D013/12, H05K005/02
  • 专利详细信息:   WO2021141575-A1 15 Jul 2021 G06F-001/16 202163 Pages: 42 English
  • 申请详细信息:   WO2021141575-A1 WOUS012629 07 Jan 2020
  • 优先权号:   WOUS012629, US17786633

▎ 摘　　要

NOVELTY - A cover (100) for electronic device comprises substrate (102) comprising metal; insert molded plastic on at least one surface of the substrate; passivation layer or micro-arc oxidation layer (104) applied on surface(s) of substrate; coating composition on the passivation or the oxidation layer; outmold decoration layer (106) on the coating composition; and chamfered edge on the substrate, where the edge cuts through the decoration layer, coating composition, passivation and/or oxidation layer, and partially through the substrate. The edge comprises a transparent passivation (108), an optional sealing, and a transparent or color electrophoretic deposition coating layer (110). USE - A cover for electronic device selected from laptop, desktop computer, keyboard, mouse, smartphone, tablet, monitor, television screen, speaker, game console, video player, and/or audio player (all claimed). ADVANTAGE - The chamfered edge is cut through the outmold decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate, thus providing the cover for the electronic device in an efficient manner. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) electronic device comprising electronic component and the cover enclosing the electronic component; and (2) manufacture of cover for electronic device which involves insert-molding plastic on greater than or equal to 1 surface of metal substrate, applying passivation layer or micro-arc oxidation layer on greater than or equal to 1 surface of the substrate, applying coating composition on the passivation layer or the micro-arc oxidation layer, forming an outmold decoration layer on the coating composition, and forming chamfered edge on the substrate. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional diagram of a cover for an electronic device. Cover (100) Metal substrate (102) Passivation layer or micro-arc oxidation layer (104) Outmold decoration layer (106) Transparent passivation layer (108) Transparent or color electrophoretic deposition coating layer (110)