▎ 摘　　要

NOVELTY - A heat-resistant epoxy resin composition comprises 15-20 wt.% graphene-modified epoxy resin, 10-15 wt.% graphene-modified phenolic epoxy resin, 8-13 wt.% diphenylmethane-diisocyanate-modified bromine-free resin, 5-15 wt.% tetrafunctional epoxy resin, 15-18 wt.% phenolic resin, 1.5-5 wt.% 4,4',4'-dioxydiphenylsulfone, 8-12 wt.% composite silicon micropowder, 3-6 wt.% aluminum hydroxide, 2-5 wt.% modified graphene oxide, 20-30 wt.% organic solvent, and 1.5-3.5 wt.% curing accelerator. USE - Heat-resistant epoxy resin composition is used for preparing halogen-free intermediate-glass-transition-temperature copper-clad plate (all claimed). ADVANTAGE - The heat-resistant composition is suitable for lead-free printed circuit board process, improves the glue viscosity, reduces resin amount during gluing, has uniform resin content, improves soaking effect, and provides copper-clad plate having excellent size stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for usage method of the composition for preparing halogen-free intermediate-glass-transition-temperature copper-clad plate, which involves opening the ice water circulating system of a glue adjusting groove, setting ice water temperature to 0-10 degrees C, adding the graphene-modified epoxy resin, phenolic epoxy resin, bromine-free resin, tetrafunctional epoxy resin, phenolic resin, and organic solvent, stirring for 120-240 minutes until the halogen-free epoxy resin is completely dissolved in the organic solvent, adding the composite silicon micropowder, aluminum hydroxide, and modified graphene oxide to the mixed material, homogenizing and shearing for 90-120 minutes, passing through a molecular sieve filter pressing barrel, absorbing and filtering the large particles in the mixed material, adding the remaining components and a catalyst, circulating and stirring for 30-120 minutes, immersing a glass fiber cloth in the obtained glue solution using a vertical gluing machine, baking at 60-120 degrees C for 5-20 minutes to form a continuous prepreg, coating a copper foil on the prepreg, and hot-pressing and forming using a hot press.