▎ 摘　　要

NOVELTY - Semi-cured polyimide sheet capable of heat pressing and resistant to high temperature comprises a high heat-conducting film and a semi-cured composition adhered to each other. The semi-cured composition comprises a heat conducting filler, a semi-curable resin, a curing agent, an accelerator and zirconium beads. The high heat-conducting film comprises polyimide film, polyimide film and/or polyethylene terephthalate film. USE - Used as semi-cured polyimide sheet capable of heat pressing and resistant to high temperature comprising e.g. high heat-conducting film. ADVANTAGE - The semi-cured polyimide sheet has good adhesion performance and good heat conducting performance; can be hot pressed with copper foil for 30 minutes within a certain pressure and temperature range and has good peel strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing semi-cured polyimide sheet capable of heat pressing and resistant to high temperature comprising (1) preparing semi-cured composition including (a1) taking semi-curable resin, heat conducting filler, solvent, and zirconium beads, mixing, stirring in a vacuum defoaming machine, (a2) adding the curing agent and the accelerator, mixing, stirring to obtain slurry of a bubble-free semi-cured composition is obtained, (2) coating the slurry of the semi-cured composition uniformly on the high heat-conducting film and (3) baking at 100-120degrees Celsius for 1.5-2.0 minutes to obtain semi-cured polyimide sheet.