• 专利标题:   Manufacturing method for image display device, involves electrically connecting light emitting element and circuit element through via on light emitting surface facing surface of light emitting element on side of insulating film.
  • 专利号:   WO2021065917-A1, TW202121677-A, CN114342091-A, JP2021551313-X, US2022223648-A1, EP4040512-A1
  • 发明人:   AKIMOTO H, QIU Y
  • 专利权人:   NICHIA CORP, NICHIA CORP, NICHIA CORP
  • 国际专利分类:   G09F009/00, G09F009/30, G09F009/33, H01L033/00, H01L033/08, H01L033/32, H01L033/38, H01L033/50, H01L033/54, H01L033/60, H01L033/62, H01L025/13, H01L027/15, H01L033/44, H01L033/22
  • 专利详细信息:   WO2021065917-A1 08 Apr 2021 202131 Pages: 95 Japanese
  • 申请详细信息:   WO2021065917-A1 WOJP036933 29 Sep 2020
  • 优先权号:   JP181637, CN80061417

▎ 摘  要

NOVELTY - The method involves preparing a first substrate including a circuit including a circuit element formed on the translucent substrate and a first insulating film covering the circuit. A layer containing graphene is formed on the first insulating film. The semiconductor layer including a light emitting layer is formed on the layer containing graphene. The semiconductor layer is etched to form a light emitting element (150-1,150-2). The layer containing the graphene, the light emitting element, and the second insulating film covering the first insulating film are formed. The vias penetrating the first insulating film and the second insulating film is formed. The light emitting element and the circuit element are electrically connected through the via on a light emitting surface facing the surface of the light emitting element on the side of the first insulating film. USE - Manufacturing method for image display device (claimed). ADVANTAGE - The transfer process of the light emitting element is shortened and the yield is improved is realized. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an image display device. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the image display devices. (Drawing includes non-English language text) Sub-pixels (20-1,20-2) Circuit board (100) Light emitting elements (150-1,150-2) Color filter (180) Film contact bonding layer (188)