▎ 摘　　要

NOVELTY - High thermal barrier and conductivity polyimide film comprises 0.5-25 wt.% sulfonated graphene with 500 nm-50 mu m radial size, 1-20 nm thickness and 12:1-6:1 molar ratio of graphene and sulfur. USE - High thermal barrier and conductivity polyimide film. ADVANTAGE - The polyimide film has excellent mechanical properties. The method is simple and easy to operate, has high controllability, and is suitable for large-scale production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of high thermal barrier and conductivity polyimide film comprising taking aromatic diamine and aromatic tetracarboxylic dianhydride molar ratio of 1:0.8-1:1.05, adding sulfonated graphene, dissolving in organic solvent, stirring for 2-48 hours, casting, heat treating at 60-300 degrees for 1-6 hours and cooling.