▎ 摘　　要

NOVELTY - Laser to packaging structure comprises a pipe seat, pipe shell covered on the pipe seat, pipe tongue set on the pipe seat, laser chip (40) and transition heat sink the laser chip is connected with the tube tongue (30) through the transition heat sink (60) the outer surface of the pipe tongue is provided with a phase-change material layer. USE - Laser to packaging structure used in a laser packaging technology field for a high-power semiconductor laser and for a laser IC. ADVANTAGE - The structure can perform phase change latent heat radiation through the phase change material layer on the pipe tongue, which improves the radiating ability of the laser. The transition heat sink eliminates the occurrence of stress caused by too fast temperature change, so that the system keeps stable working state. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a structure. Shell (10) Tube seat (20) Tube tongue (30) Laser chip (40) Phase change material layer (50)