• 专利标题:   Preparation of copper plated graphene-enhanced metal base composite material involves chemical plating copper on graphene oxide powder surface, ball milling, warm press-forming, sintering, extruding, forging, and rolling.
  • 专利号:   CN104451227-A, CN104451227-B
  • 发明人:   LENG J
  • 专利权人:   UNIV JINAN
  • 国际专利分类:   C22C001/05, C22C001/10, C23C018/40
  • 专利详细信息:   CN104451227-A 25 Mar 2015 C22C-001/05 201540 Pages: 13 Chinese
  • 申请详细信息:   CN104451227-A CN10750497 10 Dec 2014
  • 优先权号:   CN10750497

▎ 摘  要

NOVELTY - A copper plated graphene-enhanced metal base composite material is prepared by chemical plating copper on graphene oxide powder surface to obtain copper plated graphene powder, ball milling and mixing plating copper plated graphene powder and metal powder to obtain copper plated graphene/metal mixed powder, warm press-forming mixed powder with powder metallurgy warm compaction, sintering, extruding, forging, rolling, and carrying out equal composite material forming to obtain combined interface in which chemical plating is performed by sensitizing, activating, and reducing graphene oxide. USE - Preparation of copper plated graphene-enhanced metal base composite material. ADVANTAGE - The preparation increases copper plated graphene powder surface homogeneity, adjusts graphene particle shape and size, enhances dynamic and thermal physical property of material, obtains product which has good density, thermal conductivity, and wettability, high strength, and low cost, and reduces graphene powder agglomeration. DETAILED DESCRIPTION - A copper plated graphene-enhanced metal base composite material is prepared by chemical plating copper on graphene oxide powder surface to obtain copper plated graphene powder, ball milling and mixing plating copper plated graphene powder and metal powder to obtain copper plated graphene/metal mixed powder, warm press-forming mixed powder with powder metallurgy warm compaction, sintering, extruding, forging, rolling, and carrying out equal composite material forming to obtain combined interface in which chemical plating is performed by placing graphene oxide powder in sensitizing liquid, ultrasonically dispersing, washing, drying to obtain sensitized graphene in which sensitizing liquid is stannous chloride solution, placing sensitized graphene in activating liquid, ultrasonically dispersing, washing, drying to obtain activated graphene in which activating liquid is silver ammonia solution, placing activated graphene in reducing agent, washing, drying to obtain reduced graphene in which reducing agent is formaldehyde solution having 37% concentration, placing reduced graphene in chemical plating copper liquid, naturally precipitating, centrifuging, washing, and drying. DESCRIPTION OF DRAWING(S) - The drawing shows a scanning electron microscope image of copper graphene.