▎ 摘　　要

NOVELTY - Bulk molding compound composition comprises 10-60 wt.% organic mixture of thermosetting crosslinkable unsaturated polyester resins (UPR) and 1-40 wt.% reactive monomers, 0-40 wt.% low profile/shrink additive, 0.05-2 wt.% curing agent, 0.1-2 wt.% inorganic metal oxide thickening agent, 0.2-5 wt.% mold release agent/or multi-functional additive, 0-4 wt.% flow additive, 0-10 wt.% pigment paste, 1-15 wt.% conductive nano-powder, 0-60 wt.% micron sized inorganic particulate filler, and 0-50 wt.% reinforcing fibrous glass filler, where the molding viscosity of the composition is 20 million-80 million cP. USE - The bulk molding compound composition is used for electrical article (claimed) for electromagnetic interference (EMI) or radio frequency interference (RFI) application for automotive application. ADVANTAGE - The bulk molding compound composition has high thermal stability and electrical conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a process for preparing the bulk molding compound composition, which involves (a) adding performance additives by adding 0.05-0.1 wt.% conductive carbon nao-powder inclusive of reinforcing fibrous filler to an organic mixture of thermosetting crosslinkable unsaturated polyester resins and reactive monomers, and mixing to form a well dispersed resinous mix, (b) adding 2-5 wt.% constrictive additive to the resinous mix obtained in step (i), adding inorganic particulate filler, and mixing to form a homogeneous slurry, (c) adding 0.5-2 wt.% 20 million-80 million cP thickening agent for adjusting the viscosity of homogenized resinous paste to the homogeneous slurry obtained in step (ii), and mixing to obtain a homogenized resinous paste, and (d) combining the homogenized resinous paste with the reinforcing fibrous fillers to obtain the bulk molding compound composition, where the bulk molding compound composition upon processed into molds causes curing reaction of the organic mixture of thermosetting crosslinkable unsaturated polyester resins and reactive monomers results to a 3-dimensional network formation for fabricating molded electrical articles having excellent electrical conductivity and thermal stability.