• 专利标题:   Self-adhesive type graphene heat conducting gasket for use in electronic device, has bonding layer attached to heat conducting layer and surface viscosity for assembling gasket and electronic device bonding.
  • 专利号:   CN216566059-U
  • 发明人:   FANG X, HE X, ZHOU X, DOU L, YANG S, SUN A, CAO Y
  • 专利权人:   SHENZHEN HFC CO LTD
  • 国际专利分类:   C09J007/29, H05K007/20
  • 专利详细信息:   CN216566059-U 17 May 2022 H05K-007/20 202244 Chinese
  • 申请详细信息:   CN216566059-U CN22926288 26 Nov 2021
  • 优先权号:   CN22926288

▎ 摘  要

NOVELTY - The invention relates to a self-adhesive type graphene heat conducting gasket, relating to the field of heat conducting gasket. It comprises a heat conducting layer and a bonding layer set on two sides of the heat conducting layer along the thickness direction; the heat conducting layer comprises multiple layers of graphene film stacked in turn, the lamination direction of the graphene film is vertical to the thickness direction of the heat conducting layer, and the adjacent graphene film layers are coated with adhesive; the layer bonding attached to the heat conducting layer and surface viscosity for assembling the self-adhesive type graphene the heat conducting gasket and electronic device bonding The invention through multi-layer graphene film stack to obtain the heat conducting layer with ultra-high heat conducting performance, and the two sides of the heat conducting layer are respectively provided with a layer with a layer of adhesive, bonding self-adhesive self-adhesive heat graphene gasket with self-adhesive property, at the same time with ultra-high heat-conducting performance, it can be adhered to the surface device, effectively improves the dislocation displacement problem graphene the heat conducting gasket is assembled, improves the assembling graphene of the heat conducting gasket.