▎ 摘　　要

NOVELTY - A high-thermal conductivity cooling coating comprises aqueous resin, filler and functional additive. The aqueous resin includes aqueous epoxy resin, aqueous polyvinyl alcohol resin, aqueous polyurethane resin or aqueous phenoxy resin. The filler comprises graphene, carbon nanotubes, graphite oxide and/or carbon nanocage fullerene. The functional additive comprises coloring agent, dispersing agent, defoamer, adhesion promoter and curing agent. USE - The high-thermal conductivity cooling coating is useful for coating electronic components. ADVANTAGE - The coating accelerates heat dissipation, avoids performance degradation of electronic components due to insufficient cooling, and has improved stability and thermal conductivity, and prolonged service life. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method for preparing thermal conductivity cooling coating.