• 专利标题:   High-thermal conductivity cooling coating useful for coating electronic components, comprises aqueous resin, filler including graphene and functional additive including coloring agent, dispersing agent, defoamer, and curing agent.
  • 专利号:   CN104693968-A
  • 发明人:   MA J
  • 专利权人:   MA J, ANHUI HONGHUANG INFORMATION TECHNOLOGY
  • 国际专利分类:   C09D129/04, C09D163/00, C09D171/12, C09D175/04, C09D007/12
  • 专利详细信息:   CN104693968-A 10 Jun 2015 C09D-163/00 201563 Pages: 8 Chinese
  • 申请详细信息:   CN104693968-A CN10102460 09 Mar 2015
  • 优先权号:   CN10102460

▎ 摘  要

NOVELTY - A high-thermal conductivity cooling coating comprises aqueous resin, filler and functional additive. The aqueous resin includes aqueous epoxy resin, aqueous polyvinyl alcohol resin, aqueous polyurethane resin or aqueous phenoxy resin. The filler comprises graphene, carbon nanotubes, graphite oxide and/or carbon nanocage fullerene. The functional additive comprises coloring agent, dispersing agent, defoamer, adhesion promoter and curing agent. USE - The high-thermal conductivity cooling coating is useful for coating electronic components. ADVANTAGE - The coating accelerates heat dissipation, avoids performance degradation of electronic components due to insufficient cooling, and has improved stability and thermal conductivity, and prolonged service life. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method for preparing thermal conductivity cooling coating.