▎ 摘　　要

NOVELTY - A composite insulating film comprises first dielectric film made of first electronic paste coating, and second dielectric film made of second electronic paste coating. The first electronic paste coating comprises epoxy resin, curing agent, filler and solvent. The second electronic paste coating comprises epoxy resin, curing agent, filler, solvent, and less than 1 wt.%, preferably 0.7-0.9 wt.% coupling agent. The thickness of second dielectric film is less than 5 microm. The thickness of first medium film is any thickness. USE - The composite insulating film is used as packaging material for substrate, carrier plate, and dielectric layer of semiconductor electronic package of fan-out type plate-level packaging and wiring (claimed). ADVANTAGE - The film has improved peeling strength, reduces coefficient of thermal expansion, has simple preparation, and has performance which can be improved without complex device and raw material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of composite insulating film comprising preparing electronic paste composition of first electronic paste coating and second electronic paste coating, coating the first electronic paste coating on supporting substrate, drying at 50-150degrees Celsius, coating the second electronic paste coating, drying at 50-150degrees Celsius, and providing carrier film surface with release agent with thickness of less than 5 microm, where coating is by gravure printing, micro-gravure printing, comma scraper or slit extrusion.