▎ 摘　　要

NOVELTY - Heat-conducting adhesive tape without base material comprises a first release layer, an adhesive layer and a second release layer from top to bottom. The adhesive layer includes 60-80 pts. wt. rosin-based epoxy acrylate prepolymer, 5-8 pts. wt. isobornyl acrylate, 3-5 pts. wt. 3-(1,1-difluoroallyl)quinoxalin-2-ol, 1-2 pts. wt. bis (vinyl sulfone) methane, 3-5 pts. wt. methacrylic acid, 1-3 pts. wt. quaternary ammonium salt-based calix (3) carbazole, 70-130 pts. wt. isocyanate-based modified heat-conducting filler, 1-2 pts. wt. catalyst, 1-2 pts. wt. initiator and 30-70 pts. wt. organic solvent. USE - Used as heat-conducting adhesive tape without base material. ADVANTAGE - The adhesive tape; has excellent large bonding strength; and ensure the heat-conducting and stability performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the heat-conducting adhesive tape without base material, comprising uniformly mixing the components according the specific amount and coating on the second release layer and bonding the first release film layer to be rolled after ultraviolet curing and drying in an oven to obtain the product.