▎ 摘　　要

NOVELTY - A graphene heating film preparing method involves annealing the catalytic substrate copper foil to coarsen the crystal region. The annealed copper foil is microetched, grown the two-dimensional continuous structure graphene layer on the surface of the roughened copper foil to obtain a structure-I. The grapheme structure-I is transferred to the target transparent substrate by using UV glue, and removed the catalytic substrate to obtain the transparent substrate of structure-II, designed a surface printed circuit pattern, performed laser etching on the above structure-II, removed the underlying graphene layer corresponding to the silver paste line, exposed the UV adhesive layer. The counter-printing silver paste line is utilized to obtain the functionalized composite conductive structure-III. The optically clear adhesive film and the surface encapsulation layer are aligned on the surface of the composite conductive structure-III to obtain the electric heating module-IV. USE - Method for preparing graphene heating film. ADVANTAGE - The method enables preparing the graphene heating film with effectively improving graphene preparing heating film infrared emitting rate and yield and prolonging the service life. DETAILED DESCRIPTION - A graphene heating film preparing method involves annealing the catalytic substrate copper foil to coarsen the crystal region. The annealed copper foil is microetched, grown the two-dimensional continuous structure graphene layer on the surface of the roughened copper foil to obtain a structure-I. The grapheme structure-I is transferred to the target transparent substrate by using UV glue, and removed the catalytic substrate to obtain chemical vapor deposition graphene, the UV adhesive layer and the transparent substrate of structure-II from top-down, designed a surface printed circuit pattern, performed laser etching on the above structure-II, removed the underlying graphene layer corresponding to the silver paste line, exposed the UV adhesive layer. The counter-printing silver paste line is utilized to obtain silver paste line, a chemical vapor deposition graphene layer, a UV adhesive layer and a transparent substrate of functionalized composite conductive structure-III from top-down. The optically clear adhesive film and the surface encapsulation layer are aligned on the surface of the composite conductive structure-III to obtain transparent surface encapsulation layer, an optically clear adhesive layer, a silver paste printed circuit and a chemical vapor deposition graphene layer, UV glue layer, transparent substrate of the electric heating module-IV from a top-down.