• 专利标题:   Method for preparing graphene reinforced tin-based composite solder, involves mixing graphene-copper composite material, tin-based metal particles and organic carrier to obtain graphene reinforced tin-based composite solder.
  • 专利号:   CN114951947-A
  • 发明人:   YANG M, SUN S
  • 专利权人:   SHENZHEN XINYUAN NEW MATERIAL CO LTD
  • 国际专利分类:   B23K020/02, B23K020/26, B23K035/40
  • 专利详细信息:   CN114951947-A 30 Aug 2022 B23K-020/02 202294 Chinese
  • 申请详细信息:   CN114951947-A CN10825923 14 Jul 2022
  • 优先权号:   CN10825923

▎ 摘  要

NOVELTY - The method involves mechanically grinding the copper powder and the solid carbon source powder to obtain mixed powder and heating the mixed powder in a reaction chamber, and introducing reducing gas to obtain a graphene-copper composite material. The graphene-copper composite material, the tin-based metal particles and the organic carrier are mixed to obtain the graphene reinforced tin-based composite solder. The solid carbon source powder has polymethyl methacrylate, polystyrene, polytetrafluoroethylene, polyimide. The reducing gas is one of hydrogen, a mixed gas of hydrogen and argon, and a mixed gas of hydrogen and nitrogen. The organic carrier is a mixture of hydrogenated rosin resin, glutaric acid, adipic acid, ethylene glycol, propylene glycol, polyethylene glycol, terpineol. USE - Method for preparing graphene reinforced tin-based composite solder. ADVANTAGE - The interface bonding strength of graphene and copper is improved in a chemical vapor reduction mode. The heat conduction performance of the composite solder is improved, the toughness of the composite solder is improved and the mechanical reliability of the service of the welding spot is enhanced. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for packaging graphene reinforced tin-based composite solder.