▎ 摘　　要

NOVELTY - Positive temperature coefficient (PTC) heating body packaging structure, is claimed. The raw material of graphene conductive adhesive used in packaging structure comprises 45-55 pts. wt. far-infrared emitting agent, 90-110 pts. wt. graphene, 180-220 pts. wt. copper powder, and 400-500 pts. wt. high temperature resistant high molecular materials; high temperature resistant high molecular material is high temperature resistant glue and/or high temperature resistant phenolic resin. The preparation of PTC heating body packaging structure comprises (1) weighing each raw material, adding far-infrared emitting agent, graphene and copper powder to high temperature resistant high molecular material, stirring to obtain graphene conductive adhesive, and coating adhesive on electrode sheet; (2) arranging many of PTC heating elements on electrode sheet, and covering many of PTC heating elements with another electrode sheet coated with graphene conductive adhesive; and (3) heating and curing. USE - Used as PTC heating body packaging structure. ADVANTAGE - The packaging structure: has PTC heating elements having constant temperature heating and high working safety.