▎ 摘　　要

NOVELTY - A layered non-rectangular shaped multi-material heat sink (100) comprises a multi-material nano-coating containing copper material nano coating (130) and a graphene material nano-coating (140) at different thickness which is applied at a bottom layer of the single crystal silicon heat sink for improving the heat dissipation rate and thermal stability in the heat sink, and has high aspect ratio microchannels (110) in single crystal silicon (120) is fabricated using a ultrashort pulse laser micromachining at the upper portion of the heat sink which helps in rapid heat dissipation and the wavy bottom shape of the heat sink helps in increasing the total contact area of the heat sink. USE - Layered non-rectangular shaped multi-material heat sink used for regulating heat in electronic devices e.g. smartphones, and microcomputers. ADVANTAGE - The layered non-rectangular shaped multi-material heat sink is inexpensive, improves cooling efficiency at the micro-level in electronic devices, enhances life of semiconductor devices, and power electronic devices, and has high aspect ratio microchannels in single crystal silicon, higher product quality, and improved performance. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the layered non-rectangular shaped multi-material heat sink. 100Layered non-rectangular shaped multi-material heat sink 110Microchannels 120Single crystal silicon 130Copper material nano-coating 140Graphene material nano-coating