• 专利标题:   Electronic device e.g. video card for computer, has thermally conductive element which is positioned corresponding to electronic element, and heat dissipating element comprising graphene arranged on thermally conductive element.
  • 专利号:   DE202020104570-U1, CN211909500-U
  • 发明人:   YANG S, HOU X, LENG Y, LIN M
  • 专利权人:   MICROSTAR INT CO LTD, MSI COMPUTER CO LTD, MSI COMPUTER CO LTD
  • 国际专利分类:   H05K007/14, H05K007/20
  • 专利详细信息:   DE202020104570-U1 01 Oct 2020 H05K-007/20 202083 Pages: 10 German
  • 申请详细信息:   DE202020104570-U1 DE20104570 07 Aug 2020
  • 优先权号:   TW215671, CN20450729, DE20104570

▎ 摘  要

NOVELTY - The device (E) has a circuit board (100) and an electronic element (200) which is arranged on the circuit board. A thermally conductive element (300, 300A, 300B) is arranged on the circuit board. The thermally conductive element is positioned corresponding to the electronic element. A heat dissipating element (400) is arranged on the thermally conductive element. The heat dissipating element comprises graphene. The heat dissipation element includes a heating region and a heat dissipation region. The thickness of the heating region is different from the thickness of the heat dissipating region. USE - Electronic device e.g. video card (claimed) for desktop computer and notebook computer. ADVANTAGE - The heat dissipation area is enlarged, and the heat dissipation efficiency is improved. Since the heat dissipation element comprises graphene, the heat is rapidly and uniformly transferred to the heat dissipation element through the thermally conductive element, and the heat dissipation of the electronic device is significantly increased. The attachment of the contacting portion between the thermally conductive element and the electronic element is improved, and the vertical distance between the thermally conductive element and the electronic element is reduced. The transfer speed of the heat transferred to the heat dissipating element is increased. The deformation of the locking portion by the external force is prevented. The board portion protects the electronic element and prevents the main body of the circuit board from bending. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded view of an electronic device. Circuit board (100) Electronic element (200) Thermally conductive element (300,300A,300B) Heat dissipating element (400) Electronic device (E)