• 专利标题:   Electrode structure for power semiconductor chip, has radiating grooves whose surface is fixedly provided with heat radiating blocks, and electrode plates including outer side including end provided with pressing mechanism for fixing pin.
  • 专利号:   CN112510002-A, CN213936178-U
  • 发明人:   ZHENG Y, ZHOU Q, WANG Y
  • 专利权人:   SHAANXI SIKAIDI IOT TECHNOLOGY CO LTD
  • 国际专利分类:   H01L023/367, H01L023/373, H01L023/48
  • 专利详细信息:   CN112510002-A 16 Mar 2021 H01L-023/48 202136 Pages: 7 Chinese
  • 申请详细信息:   CN112510002-A CN11386489 02 Dec 2020
  • 优先权号:   CN11386489, CN22846012

▎ 摘  要

NOVELTY - The structure has a power semiconductor chip (1) whose upper surface is formed with multiple heat radiating grooves (2). A middle portion of the radiating grooves is formed with a placing groove. Multiple electrode plates (3) are embedded in the placing groove. A surface of the radiating grooves is fixedly provided with multiple heat radiating blocks. An inner side of each radiating block is propped against a side wall of the electrode plates. An end of an outer side of the electrode plates is provided with a pressing mechanism for fixing a pin (4). The heat radiating blocks are made of graphene material. USE - Electrode structure for a power semiconductor chip. ADVANTAGE - The structure can improve heat radiating efficiency of a motor and make the electrode connected with a pin firmer. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an electrode structure for a power semiconductor chip. Power semiconductor chip (1) Heat radiating grooves (2) Electrode plates (3) Pin (4)