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  • 专利标题:   Diamond composite heat sink material used in fields of microelectronic devices and lighting lamps, contains diamond, graphite oxide, carbon nanotubes, graphene, oxide material, anionic epoxy resin and cationic polyurethane resin.
  • 专利号:   CN105131699-A
  • 发明人:   HE M, ZHANG Y, ZHENG S, LA X
  • 专利权人:   UNIV SOUTH CHINA NORMAL
  • 国际专利分类:   C09D005/44, C09D007/12
  • 专利详细信息:   CN105131699-A 09 Dec 2015 C09D-007/12 201634 Pages: 6 English
  • 申请详细信息:   CN105131699-A CN10639571 29 Sep 2015
  • 优先权号:   CN10639571

▎ 摘　　要

NOVELTY - A diamond composite heat sink material comprises components (A) and (B). The thermal emissivity of component (A) is greater than 0.93 that of diamond composite. The component (B) is an aqueous ionic modified resin. The components (A) and (B) are used in an amount of is 2-15%. USE - The diamond composite heat sink material is useful in fields of microelectronic devices and lighting lamps. ADVANTAGE - The diamond composite heat sink material can be prepared in a simple and economical manner with high rate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of diamond composite heat sink material.