▎ 摘　　要

NOVELTY - Electroplating of metal on surface of insulating base material involves (1) mixing resin, solvent, solid filler and curing agent uniformly to obtain resin coating, (2) coating the resin coating on the surface of insulating substrate, after curing, forming a resin coating with small gap structure on the surface of the insulating substrate, (3) coating conductive substance on the resin coating, after drying, forming a uniform conductive film on the surface of the resin coating and the conductive material in the conductive film is used as active site for subsequent electroplating, (4) placing the insulating base material covered with the conductive film in plating solution for direct electroplating. USE - Electroplating of metal on surface of insulating base material for printed circuit board (claimed). ADVANTAGE - The method uses resin as the middle layer of conductive layer and through growing and filling metal in the small gap of the resin coating to obtain the plating metal layer with excellent adhesive force on substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of printed circuit board.