▎ 摘　　要

NOVELTY - The interconnect structure (120) comprises a dielectric layer (121) including a trench (121a), a conductive wiring (125) filling an inside of the trench, and a cap layer (127) on the surface of the conductive wiring. The cap layer includes nanocrystalline graphene comprising nano-sized crystals. USE - Interconnect structure for use in electronic device (claimed). ADVANTAGE - The electrical resistance of a conductive wiring may be reduced by providing a cap layer including nanocrystalline graphene in the conductive wiring, improving electromigration resistance. Enables to reduce the occurrence of defects in the conductive wiring, limiting and/or preventing the conductive wiring from being damaged. DESCRIPTION OF DRAWING(S) - The drawing shows the sectional view of an electronic device having an interconnect structure. Interconnect structure (120) Dielectric layer (121) Trench (121a) Conductive wiring (125) Cap layer (127)