▎ 摘　　要

NOVELTY - The method involves preparing (S1) a copper clad laminate comprising a copper layer of a line. A graphene electroplating solution is prepared (S2) to electroplate a graphene layer on the copper-clad board comprising a line copper layer and obtain a copper-clad board comprising a graphene layer. The circuit pattern of the green oil film is transferred (S3) to the copper clad board containing the graphene layer. A molding treatment is carried out (S4) according to requirements to obtain PCB. The graphene layer electroplated on the copper-clad board comprising a line copper layer involves adding the graphene powder into the acid-base solution to obtain the graphene electroplating solution. The components of the acid-base solution are 20-30 g/L of sulfuric acid, and 1.11-2.20 g/L of hydrogen peroxide. USE - Manufacturing method of heat-dissipating printed circuit board (PCB) used as support for electronic components (all claimed) in electronic products. ADVANTAGE - The graphene layer is electroplated on the circuit copper layer, and the uniform heat dissipation of each area of the PCB is enhanced through the high heat conduction and high radiation characteristics of the graphene layer. The surface temperature of the heat dissipation PCB is reduced by 2-3 degrees. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a heat-dissipating PCB; and (2) an electronic component. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart illustrating a manufacturing method of heat-dissipating PCB. (Drawing includes non-English language text) S1Step for preparing a copper clad laminate S2Step for preparing a graphene electroplating solution S3Step for transfering the circuit pattern of the green oil film to the copper clad board S4Step for carrying out the molding treatment