▎ 摘　　要

NOVELTY - Preparation of hot melt adhesive tape involves (1) providing the raw materials comprising 40-60 %mass copolyamide, 10-15 %mass rubber, 10-15 %mass terpene resin, 5-10 %mass polyurethane, 5-10 %mass talc, 4-5 %mass foaming agent, 1-5 %mass maleic anhydride grafted polyethylene wax and 1-5 %mass graphene, (2) adding the weighed copolyamide, rubber, terpene resin, polyurethane and maleic anhydride grafted polyethylene wax into the reactor to obtain hot melt adhesive semi-finished product (A), (3) adding the pre-weighed talc powder to the interior of the obtained hot melt adhesive (A), controlling the reactor to increase the internal temperature to 70-150 degrees C, to prepare the hot melt adhesive semi-finished product (B), (4) preparing hot melt adhesive semi-finished product (C), (5) adding foaming agent to the obtained hot melt adhesive semi-finished product (C) in the reactor to obtain hot melt adhesive layer, and (6) cooling and coating prepared hot melt layer. USE - Preparation of hot melt adhesive tape used for packaging electronic chip. ADVANTAGE - The method produces hot melt adhesive tape which generates gas foam after heating to form thick adhesive tape layer. The adhesive tape produced has low packaging temperature, utilizes the conductivity of conductive graphene particles, avoids using the welding method of coil and module and reduces the processing steps. DETAILED DESCRIPTION - Preparation of hot melt adhesive tape involves (1) providing the raw materials comprising 40-60 %mass copolyamide, 10-15 %mass rubber, 10-15 %mass terpene resin, 5-10 %mass polyurethane, 5-10 %mass talc, 4-5 %mass foaming agent, 1-5 %mass maleic anhydride grafted polyethylene wax and 1-5 %mass graphene, (2) adding the weighed copolyamide, rubber, terpene resin, polyurethane and maleic anhydride grafted polyethylene wax into the reactor, controlling the reactor to increase the internal temperature to 70-140 degrees C, stirring and mixing, when the temperature inside the reactor reaches more than 200 degrees C, starting the polycondensation reaction at 200-300 degrees C and pressure of 1.7-2.7 MPa, starting a reaction kettle to release pressure for 1.0-2.0 hours after the polycondensation reaction starts, reducing the pressure of the reaction kettle to normal pressure for 1-2 hours, continuously reacting for 1-2 hours to obtain hot melt adhesive semi-finished product (A), (3) adding the pre-weighed talc powder to the interior of the obtained hot melt adhesive (A), controlling the reactor to increase the internal temperature to 70-150 degrees C, starting the stirring reaction, keeping the reaction kettle for 0.5-1 hour to prepare the hot melt adhesive semi-finished product (B), (4) adding the pre-weighed graphene to the reaction kettle containing semi-finished product (B) and starting the reactor to stirring and reacting for 1-2 hours to obtain hot melt adhesive semi-finished product (C), (5) heating the reaction temperature of the obtained hot melt adhesive semi-finished product (C) in the reactor to 150-160 degrees C, adding foaming agent to the hot melt adhesive semi-finished product (C) in the reactor, stirring and mixing the hot melt adhesive semi-finished product (C) and foaming agent and stirring the reactor for 1-2 hours to obtain hot melt adhesive layer, and (6) cooling the prepared hot melt layer, defoaming under the negative pressure controlled at -0.1 MPa and evenly coating the hot melt adhesive layer on the base layer.